- Overview
- Product Description
Basic Info.
Model NO.
MH
Certification
CE
Warranty
24 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Product Type
6",8",12" Wafer, 2.5D/3D Packaging
3D Inspection Project
Bump Height, Bump Coplanality
Cassette &Transmission Method
8"Smif , 12" Foup or Combination
Precision
0.55um/Pixel
Trademark
MINDER-HIGHTECH
Origin
China
Production Capacity
1000
Product Description
Wafer 2D&3D Optical Inspection AOI System
Software Introduction 1.Supports multi-level permissions and permission operation log functions
2.The equipment menu bar covers a wide range of functions
3.Automatically generates mapping and production reports
4.Displays task status in real-time.
5.Combines traditional algorithms with Al for fast and accurate defect
identification.
Technical Parameter
| Project | Content |
| Product Type | 6",8",12" wafer, 2.5D/3D packaging |
| 2D Inspection ltems | Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc. |
| 2D Metrology | Bump diameter, needle mark coordinates, RDL and TSV metrology, etc. |
| 3D Inspection Project | Bump height, Bump coplanality |
| Cassette &Transmission Method | 8"SMIF , 12" FOUP or combination |
| Lens and Resolution | 2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um) |
| Precision | 0.55um/pixel |
| Optional and Customized | Double sided OCR,3D module, supported by E84 |